An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.

 
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< Arrangement of vias in a substrate to support a ball grid array

< Semiconductor device, stacked semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

> Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks

> Probe card assembly
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