Disclosed herein is an architecture of connecting a transceiver module for an optical PCB, in which an active photo-electric element and other components to be integrated in the optical PCB having waveguides are packaged, waveguides arranged in the optical PCB, and an optical connection block for optical coupling between the transceiver module and the waveguides of the optical PCB. Guide pin insertion holes are formed at one sides of the ends of the waveguides such that the optical PCB, the transceiver module and the optical connection block can be passively aligned using guide pins inserted into the guide pin insertion holes.