A system facilitating measurement and correction of overlay between
multiple layers of a wafer is disclosed. The system comprises an overlay
target that represents overlay between three or more layers of a wafer
and a measurement component that determines overlay error existent in the
overlay target, thereby determining overlay error between the three or
more layers of the wafer. A control component can be provided to correct
overlay error between adjacent and non-adjacent layers, wherein the
correction is based at least in part on measurements obtained by the
measurement component.