A heat dissipation device includes a core including a base with a bottom face and a top face and a body extending from the top face of the base, thermally conductive medium spread on the bottom face fo the base, a plurality of fin stacked along the body above the base, and a protective cover firmly disposed around the base of the core. An offset exists between the bottom face of the cover and the spread area of the medium.

 
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< High-density architecture for a microelectronic complex on a planar body

< Modular heat recovery ventilation system

> Heat dissipation assembly with resilient fastener

> Protection structure for thermal conducting medium of heat dissipation device

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