The invention provides a compact, inexpensive optical communication module with high product reliability. In particular, the invention can include an optical communication module having a substrate with a through-hole into which an optical fiber can be inserted and removed, a light-transmissive resin film disposed on one side of the substrate and covering the through-hole, an electrically conductive film patterned on top of the light-transmissive resin film, and an optical element connected to the electrically conductive film, positioned with reference to the through-hole, and disposed above the through-hole so that light can be transmitted and received through the through-hole, and, where necessary, encapsulated with a sealant.