A hot melt adhesive composition is based on an isotactic polypropylene random copolymer (RCP). The composition contains about 4% 50% by weight of the RCP copolymer, about 20% 65% by weight of a compatible tackifier, about 0% 40% by weight of a plasticizer, about 0% 3% by weight of a stabilizer, about 0% 40% by weight of a wax, and optionally about 0% 60% by weight of an atactic poly-.alpha.-olefin (APAO). The adhesive composition may be used in a number of applications such as, for example, in disposable nonwoven hygienic articles, paper converting, flexible packaging, wood working, carton and case sealing, labeling and other assembly applications.