The photosensitive film for circuit formation of the present invention has: on a first film (base film), a photosensitive layer having a thickness of 0.1 to 10 .mu.m; or a photosensitive layer having a thickness of 0.1 to 14 .mu.m and containing a 2,2-bis(4-((meth)acryloxypolyalkoxy)phenyl)propane.

 
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