A method can be provided of forming a photoresist pattern on a substrate.
The method employs a photoresist composition comprising a photosensitive
polymer, the photosensitive polymer has a molecular weight in a range of
from about 1,000 up to about 100,000 and comprises repeating units having
a structural formula: wherein R represents an acid-labile hydrocarbon
group having from 1 up to 20 carbon atoms.