Provided is an anisotropic conductive adhesive for a fine pitch having a conductive adhesive layer and a nonconductive adhesive layer formed on one surface or both surfaces of the conductive adhesive layer. The anisotropic conductive adhesive for a fine pitch can be used to adhere an integrated circuit, on which a plurality of bumps each having a second height are formed, to a substrate, on which a plurality of electrodes each having a first height are formed keeping predetermined distances from each other, so that the integrated circuit is electrically connected to the electrodes. The anisotropic conductive adhesive includes a nonconductive first adhesive layer and a second adhesive layer. The nonconductive first adhesive layer includes a thermosetting resin and a hardener for hardening the thermosetting resin and has a first thickness of 1/2 3/2 of the second height. The second adhesive layer includes a thermosetting resin, a hardener for hardening the thermosetting resin, and a plurality of conductive particles each having an average particle diameter of 1/2 or less of the width of gaps between the plurality of electrodes and a first density dispersion, has a second thickness larger than two times the average particle diameter of the conductive particles, and is formed on one surface of the nonconductive first adhesive layer.