The invention refers to a cooling device for an electrical/electronic unit, comprising a heat-conductive base body, which has an envelope surface and which is suitable for being contacted with the unit to be cooled, further comprising a cooling profile body which is arranged at a spacing to the base body and which encompasses at least part of the envelope surface of the base body, wherein a locked, partially evacuated space is arranged between the base body and the cooling profile body, and further comprising a fleece soaked by a liquid and attached to the envelope surface of the base body.