A method for manufacturing a plasma display apparatus includes bonding a panel to a sustaining board (chassis) with a sufficient bonding area. In a process of bonding the panel to the chassis, the panel is supported on the sustaining board (chassis) via a heat conducting sheet. Then the panel and the chassis are sandwiched between resilient pressuring boards, which are larger than the panel and the chassis. After that, a predetermined pressure is applied from at least one of the pressuring boards, thereby bonding the panel to the chassis via a heat conducting sheet.

 
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