A semiconductor device assembly including a semiconductor device having a
plurality of bond pads on the active surface thereof and a lead frame
having a portion of the plurality of lead fingers of the lead frame
located below the semiconductor device in a substantially horizontal
plane and another portion of the plurality of lead fingers of the lead
frame located substantially in the same horizontal plane as the active
surface of the semiconductor device. Both pluralities of lead fingers of
the lead frame having their ends being located substantially adjacent the
peripheral sides of the semiconductor device, rather than at the ends
thereof.