An integrated circuit die contains digital circuitry that emits noise (for example, in the audio frequency range) in the form of electromagnetic radiation. The integrated circuit die is provided with a shielded platform above the digital circuitry. The shielded platform has one metal plate that is coupled to an analog supply voltage source and another metal plate that is coupled to an analog ground terminal. The digital circuitry is coupled to a digital supply voltage source. A second die with noise-sensitive analog circuitry is stacked on the shielded platform and is shielded by the shielded platform from the noise. The analog circuitry is powered by the analog supply voltage source. Conductive vias in a predetermined pattern protrude through the shielded platform and provide a standardized way of connecting any one of numerous noise-sensitive second dice to the relatively noisy digital circuitry of the underlying die.