Integrated circuits, semiconductor devices and methods for making the same are described. Each embodiment shows a diffused, doped backside layer in a device wafer that is oxide bonded to a handle wafer. The diffused layer may originate in the device handle, in the handle wafer, in the bond oxide or in an additional semiconductor layer of polysilicon or epitaxial silicon. The methods use a thermal bond oxide or a combination of a thermal and deposited oxide.

 
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> Apparatus and method for treatment using a patterned mask

> Phase shift modulation-based control of amplitude of AC voltage output produced by double-ended DC-AC converter circuitry for powering high voltage load such as cold cathode fluorescent lamp

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