A method of fabricating an integrated circuit having an optically transmissive window therein includes forming an integrated chip preform structure that includes a plurality of bonding wires connecting pads on a die structure to pads on a lead frame structure, at least some of the bonding wires having a selected portion, such as a looped portion, that defines or establishes a common mounting plane or support surface therebetween. A quantity of an uncured or partially cured optically transmissive material is deposited on the die portion of the integrated circuit preform and the window is thereafter placed on the uncured or partially cured optically transmissive material and positioned so that the window is on or in the mounting plane or support surface defined by the bonding wires. The so-assembled components are then subject to a curing step to cure the optically transmissive media and thereafter subject to an encapsulation step. If desired the curing step and the encapsulation step can be partially or fully concurrent with one another. The resulting integrated chip package utilizes the mounting or support plane defined by or established by the bonding wires to efficiently maintain the position of the window during fabrication.