This invention relates to a resin composition capable of being thermally cured while minimizing or eliminating voids in the resulting composite, the composition having both a long pot life at low temperatures and a fast curing rate at higher temperatures containing a mixture of (a) a phenol-formaldehyde resole resin, and (b) an etherified hardener, the etherified hardener being prepared from an alkoxylated polyol or a mono epoxy functional diluent.

 
Web www.patentalert.com

< Pattern for absorbent paper

< Packing made from a film-like laminate and process for production of this packing

> Apparatus and method for stretch-wrapping articles

> Packaging container for moist cloths or moist cosmetic pads

~ 00281