A light emitting diode (LED) assembly including an LED, an optically transmissive cover and a base for supporting the LED. The optically transmissive cover encapsulates the LED and includes a stiffener for reinforcing a base portion of the cover. The base includes electrical leads extending therefrom that are electrically connected to the LED. To make the cover, at least one support frame is formed in a strip of substantially rigid material. The at least one support frame is connected to a processing portion of the strip. At least one lens is overmolded on the at least one support frame that is connected to the processing portion. The overmolded support frame is removed from the processing portion of the strip.