An epoxy resin composition is provided, which includes (A) an epoxy resin with at least 2 epoxy groups within each molecule, (B) a curing agent, and (C) a foaming agent. This composition displays excellent flame retardancy and reliability and is suitable for use as a semiconductor encapsulating material.

 
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< Separation agent for separating optical isomer and method for preparation thereof

> Liquid crystal aligning agent for vertical alignment, alignment layer for liquid crystal, and liquid crystal displays made by using the same

> Dielectric films and materials therefor
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