In a process for patterning both sides of a double-sided HTS thin film
wafer with the patterns in close registration, the first side is patterned
with at least one reference mark and the second side is patterned with at
least one aperture which permits alignment of the reference mark from the
already applied pattern on the first side preferably to a similar
reference mark on the yet to be applied patterns on the second side, such
that the patterns can be aligned in close registration, using microcopic
viewing techniques if necessary.