A chip package is made with the ring or dish interposer and an embedded array capacitor. A computing system is also disclosed that includes the ring or dish interposer and the embedded array capacitor.

 
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< Semiconductor device and method of manufacturing a semiconductor device

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> Semiconductor device

> Substrate having a planarization layer and method of manufacture therefor, substrate for electro-optical device, electro-optical device, and electronic apparatus
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