Processes for modifying the surface chemistry of a clay are disclosed. In one embodiment, there is provided a process for modifying the surface chemistry of a clay, wherein the process comprises: providing a clay dispersion comprising at least one unmodified clay wherein said clay has a first exchangeable cation; adding a second cation to the clay dispersion, wherein at least a portion of the second cation exchanges with at least a portion of the first cation to form a modified clay dispersion; and combining at least one polar containing agent with the modified clay dispersion to provide a modified clay.