A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.

 
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< Single electron devices formed by laser thermal annealing

< Single electron transistor having memory function

> Semiconductor material, field effect transistor and manufacturing method thereof

> Apparatus, materials, and methods for fabrication and catalysis
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