A solder ball is formed from an Sn--Pb alloy which consists essentially of about 2 65 mass % of Sn, 0 5 mass % of Ag, about 0.1 1 mass % of Sb, and 0.01 0.1 mass % of Cu, and 0.01 0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder ball has improved thermal fatigue resistance, good solderability, and good surface brightness after soldering.