An electronic apparatus includes a housing and a printed wiring board
contained in the housing. The printed wiring board includes a first
surface, a second surface and a conductive layer. The first surface has a
mounting area, the second surface is located opposite to the first
surface in a position corresponding to the mounting area, between the
first surface and the second surface. A heat generating component is
mounted on the mounting area of the printed wiring board. A reinforcing
member is provided on the second surface of the printed wiring board, and
is in thermal contact therewith. The heat of the heat generating
component is conducted to the reinforcing member through the printed
wiring board, and is radiated from the reinforcing member.