An integrated power module includes a longitudinally extending mounting
member defining a cooling passageway on a first side thereof. A heat sink
is positioned in the cooling passageway. A printed circuit board is
positioned proximate a second side of the mounting member opposite the
first side. A heat generating power circuit is electrically coupled to
the printed circuit board and positioned between the printed circuit
board and the mounting member. The power circuit is thermally coupled to
the heat sink. An inductor is mounted in the cooling passageway. Methods
of forming an integrated power module are also provided.