A semiconductor device has an alignment mark which can be recognized by a
conventional wafer prober. A redistribution layer connects electrodes of
the semiconductor device to electrode pads located in predetermined
positions of the redistribution layer. Metal posts configured to be
provided with external connection electrodes are formed on the electrode
pads of the redistribution layer. A mark member made of the same material
as the metal posts is formed on the redistribution layer. The mark member
serves as an alignment mark located in a predetermined positional
relationship with the metal posts.