A package arrangement is provided. The package arrangement in general includes a blister pack having a backing construction secured thereto. In preferred arrangements, a removable header is provided. The backing construction preferably includes a flexible film having resealable pressure sensitive adhesive on a side thereof, by which the backing portion is secured to the blister pack. A portion of the backing construction is formed as a hinged cover portion, by two cuts, preferably parallel, extending through the backing construction portion and overlapping a selected section of the blister pack. In a preferred arrangement, each cut terminates at a stop structure.