An improved and more flexible connector assembly and method are provided for connecting an electrical component to a substrate, such as a printed circuit board (PCB), by attaching an electrical component having ball or column grid array solder portions to corresponding electrical contact surfaces of a second connector half, mating first and second connector halves and attaching the first connector half having ball or column grid array solder portions to corresponding electrical contact surfaces of the substrate. The first and second connector halves may be electrically connected to each other via conventional mating techniques. When mated, electrical communication is achieved between corresponding portions of the first and second connector halves. Effects of CTE mismatch are minimized by providing the first and second connector halves between the electrical component and substrate.