Integrated circuit components are imbedded within a laminate substrate disposed on a thermally conductive core, which provides a thermal sink. The circuit components are electrically connected to the integrated circuit via flexible electrical interconnects such as flexible wire bonds. An electrically insulating coating, is deposited upon the flexible electrical interconnects and upon the exposed surfaces of the integrated circuit assembly. The coating provides rigidity, an electrically insulating barrier and a first environmental barrier for preventing contamination of the exposed surfaces of the integrated circuit assembly. A thermally conductive encapsulating material, such as silicon gel, encases the circuit components and the flexible electrical interconnects within a rigid or semi-rigid matrix. The encapsulating material provides additional mechanical support, a second environmental and a thermal sink for dissipation of heat.