The present invention provides a resin composition comprising a polyimide
containing particular dianhydride and diamine, and an epoxy resin. The
resin composition can be bonded at a relatively low temperature, has
excellent heat resistance, adhesion property, soldering heat resistance
and retaining ratio of peeling strength after PCT. By forming a circuit
using the polyimide resin sheet or the polyimide resin sheet with metal
foil, which comprises the resin composition, according to the
semi-additive method, a printed wiring board having a good wiring shape,
firm adhesion of circuit and high insulating resistance in the
microcircuit space can be obtained.