The capacitor element includes a chip body 2 prepared by compacting valve metal powder into a porous body and sintering the body, and an anode bar 3 fixed to the chip body so as to project from an end surface 2a of the chip body. A solid electrolyte layer 5 of conductive polymer is formed on the chip body via a dielectric film 4. A cathode film 6 is formed on the solid electrolyte layer. The solid electrolyte layer 5 formed at the end surface 2a of the chip body 2 includes carbide 5a formed by pyrolysis of the solid electrolyte layer to surround the entire circumference of the anode bar 3, so that damage is prevented from occurring at the root portion of the anode bar.