A method for joining a protective tape to a semiconductor wafer includes
the steps of: mounting a semiconductor wafer, which has a surface with a
pattern formed thereon, on a holding member; joining a protective tape,
which protects the pattern, to the surface of the semiconductor wafer
and, also, to a surface of an outer peripheral member disposed around the
holding member; and cutting out the protective tape along an outer
circumference of the semiconductor wafer. The holding member and the
outer peripheral member are disposed on a holding table, which holds the
semiconductor wafer, so as to be adjacent to each other, and the outer
peripheral member is formed from a member which is different from that of
the holding table.