A solid-state semiconductor light emitting device is disclosed. A heat
sink that comprises a receiving cup for receiving a chip is provided. A
leadframe that comprises a connection base is mounted above the heat
sink, wherein the chip is connected to the leadframe via a metal wire and
a resin or silicone is applied to cover all of them so as to form the a
light emitting device that emits light. In the leadframe, two holders
that include two top sides on their two top portions are opposite to one
another, and a holder having holes is mounted between these two top
sides. The holder having the holes is connected to one of these two
opposite holders. A plastic material is applied to mold the three holders
into the connection base for receiving the receiving cup of the heat
sink. As a result, the heat sink provides with good heat-dissipating
efficacy and each holder of the leadframe also provides with
heat-dissipating efficacy and enhances connection stability as well.