The present invention relates to a radiator sheet improvement and more particularly to a structure with enhanced strength and increased heat exchange surface after assembling, which is achieved first by forming large holes and adjacent small holes on each radiator sheet, wherein a radiator tube passing through each large hole and a solder rod or tin solder inserted into each small hole, and then by using heat to melt solder to fill the space between the radiator sheet and the radiator tube, thereby enabling a firm bonding effect therebetween.