A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.

 
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< Staggered fin array

< Hydrofluoroether as a heat-transfer fluid

> Cooling device using multiple fans and heat sinks

> Radial flow heat exchanger

~ 00299