Sensor package systems and methods are disclosed, which include a quartz
sensor package encapsulated by an overmold material. A surface acoustic
wave sensing element and one or more bonding pads can be integrated with
the quartz sensor package. Additionally, one or more antennas can be
respectively bonded to the quartz sensor package at the bonding pads,
such that the antennas communicates electrically with the surface
acoustic wave sensing element and permits wireless interrogation of the
quartz sensor package including the surface acoustic wave sensing element
from an external wireless source.