A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a routing line, a bumped terminal and a metal filler, a connection joint that electrically connects the routing line and the pad, and an encapsulant. The routing line is contiguous with and integral with the bumped terminal and extends laterally beyond the bumped terminal and the metal filler, and the metal filler contacts the bumped terminal in a cavity that extends through the bumped terminal.