The present invention provide a chemically amplified positive resist composition comprising a resin which contains a structural unit having an acid labile group and which itself is insoluble or poorly soluble in an alkali aqueous solution and becomes soluble in an alkali aqueous solution by the action of an acid; an acid generator; and a compound of the formula (C-1) ##STR00001## wherein R.sup.1 and R.sup.2 each independently represents a hydrogen or an alkyl having 1 to 4 carbon atoms, R.sup.3, R.sup.4 and R.sup.5 each independently represents a hydrogen or a hydroxyl.

 
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> Organosiloxane polymer, photo-curable resin composition, patterning process, and substrate protective film

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