Methods and apparatus for controlling the distance between contact pads or leads which are to be interfaced are disclosed. According to one aspect of the present invention, an electrical package includes a body and a contact. The body includes electrical circuitry such as traces. The contact is arranged on the body, and includes a contact body and a contact feature. The contact feature is a protrusion which substantially extends from the contact body, and is arranged to come into contact with an external surface. In one embodiment, the external surface is an external contact, and the contact feature is arranged to substantially space the contact body away from the external contact.

 
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> Apparatus and method for processing a microelectronic workpiece using metrology

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