Buried backside conductive layers with increased conductive efficiency can be provided for thermally developable materials using a specific organic solvent mixture to coat a protective overcoat directly disposed over the conductive layer. This organic solvent mixture comprises an alcohol in which one or more film-forming polymers used in the formulation are soluble at room temperature. The alcohol is used in an amount of more than 10 and up to 90 weight % of the organic solvent mixture.