In a chip-type noise filter having a signal line of a conductor and a magnetic body disposed so as to adhere to the signal line, the magnetic body is a sintered body containing mainly Fe.sub.2O.sub.3 and containing NiO in the rest. This enables to effectively absorb and damp noise of quasi-millimeter wave and millimeter wave, and even if used at the inside of semiconductor package, no outgassing occurs at the time of temperature rise in the assembly process and operating conditions thereof, thereby permitting improvement of the characteristics of the semiconductor package, along with high reliability.