A capacitance coupled, transmission line-fed, radio frequency MEMS switch
and its fabrication process using photoresist and other low temperature
processing steps are described. The achieved switch is disposed in a low
cost dielectric housing free of undesired electrical effects on the
switch and on the transmission line(s) coupling the switch to an
electrical circuit. The dielectric housing is provided with an array of
sealable apertures useful for wet, but hydrofluoric acid-free, removal of
switch fabrication employed materials and also useful during processing
for controlling the operating atmosphere surrounding the switch--e.g. at
a pressure above the high vacuum level for enhanced switch damping during
operation. Alternative arrangements for sealing an array of dielectric
housing apertures are included. Processing details including plan and
profile drawing views, specific equipment and materials identifications,
temperatures and times are also disclosed.