A radiation shielded module (120, 500, 600, 700) and method of shielding microelectronic devices (126, 412, 618, and 718) including a single interconnect substrate (110, 400, 612, 712) having a first side (122, 410, 620, 720) and a second side (124, 416, 610, 710). At least one microelectronic device is coupled to the first side of the single interconnect substrate. A shielding structure (100, 200, 300, 614, 714) is coupled to the single interconnect substrate and configured to shield radio frequency interference (RFI) and electromagnetic interference (EMI) that propagate through at least a portion of the single interconnect substrate.