A heat sink disposable on a heat transfer surface of a heat-generating source such as an electronic component. The heat sink includes a base portion and a body portion. The base portion has a first surface disposable on the heat transfer surface, and a second surface opposite the first surface. The body portion is joined to the second surface of the base portion and is formed of a stack of corrugated sheets of one or more metal foils arranged to form a cellular, honeycomb-like structure.

 
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