The present invention is directed to a new bonding pad structure that
includes a copper pad and a pad surface finish comprising multiple layers
of solder. The multiple layers of solder include at least a layer of
eutectic solder (or a layer of pure-Sn solder) covering the copper pad
and a layer of high-Pb solder covering the layer of eutectic solder (or
the layer of pure-Sn solder). Since the layer of high-Pb solder is
significantly thicker than the eutectic solder layer (or the layer of
pure-Sn solder), there is insufficient tin supply in the eutectic solder
(or the layer of pure-Sn solder) for forming a thick Cu/Sn intermetallic
layer on the copper pad. Instead, a thin Cu/Sn intermetallic layer is
formed on the copper pad and there is less likelihood of forming a crack
in the thin Cu/Sn intermetallic layer.