An integrated semiconductor structure having different types of complementary metal oxide semiconductor devices (CMOS), i.e., PFETs and NFETs, located atop a semiconductor substrate, wherein each CMOS device is fabricated such that the current flow for each device is optimal is provided. Specifically, the structure includes a semiconductor substrate that has a (110) surface orientation and a notch pointing in a <001> direction of current flow; and at least one PFET and at least one NFET located on the semiconductor substrate. The at least one PFET has a current flow in a <110> direction and the at least one NFET has a current flow in a <100> direction. The <110> direction is perpendicular to the <100> direction. A method of fabricating such as integrated semiconductor structure is also provided.

 
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> Dual-sided substrate integrated circuit package including a leadframe having leads with increased thickness

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