In a method and apparatus for handling semiconductor materials, a robot arm includes a tubular shaft having a distal end and a proximal end. A distal block disposed over the distal end is detachably secured to the distal end and a proximal block disposed over the proximal end is detachably secured to the proximal end. The tubular shaft, which has an adjustable length, is formed from a warp-resistant material that has sufficient strength to maintain a longitudinal axis alignment of the tubular shaft within a predefined tolerance. The distal block and the proximal block are customized to substantially match corresponding features of a legacy robot arm, thereby enabling a complete replacement of the legacy robot arm.