A process for protecting first electrodes, conductive leads and the underlying substrate from the process of removing organic layers during the fabrication of an organic electronic device. After first electrodes and conductive leads are formed over a substrate, a protective layer is selectively formed over the structure, with the protective layer not being disposed over selected portions of the first electrodes, the conductive leads and the substrate. Organic layers are then formed over the structure, and second electrodes are formed over the organic layers. Those portions of the organic layers disposed over the selected portions of the first electrodes, conductive leads and substrate are removed, and the protective layer protects adjacent portions of the first electrodes, conductive leads and substrate from the process of removing the portions of the organic layers.