A solid-state imaging element 2 having a light-receiving portion where a plurality of photoelectric conversion elements 21 are arranged, and electrode pads 22 electrically connected to the photoelectric conversion elements 21 is mounted on a substrate 1 having external connection electrodes 12 and electrode pads 11 electrically connected to them. A scintillator 3 is formed on the surface of the light-receiving portion of the solid-state imaging element 2. The electrodes pads 11 and 22 are electrically connected by wiring lines 4. An electrical insulating organic film 51 tightly seals the scintillator 3 and covers the electrode pads 11 and 22 and the wiring lines 4. A metal thin film 52 is formed on the organic film 51.