A mold-type electronic control unit comprising: a unit body which includes a printed circuit board, a component case which includes an opening opened toward the circuit board and a hole opened toward the opposite side of the opening and is mounted on the circuit board, a first packing which includes a recess portion and a window portion opened inside of the recess portion and is attached so as to close the opening of the component case with the recess portion directed toward the printed circuit board, a pressure sensor housed in the recess portion of the first packing and having a pressure introducing portion exposed in the component case through the window portion, and a second packing mounted on an outer side of the component case; and a resin molded portion covering the unit body, wherein said second packing is used as means for preventing resin from flowing toward the hole of the case when the molded portion is injection molded.